首页> 外文OA文献 >Metal Hard Mask Employed Cu/Low k Film post Ash and Wet Clean Process Optimization and Integration into 65nm Manufacturing Flow

【2h】

Metal Hard Mask Employed Cu/Low k Film post Ash and Wet Clean Process Optimization and Integration into 65nm Manufacturing Flow

机译：金属硬质面罩采用Cu / Low k薄膜后灰和湿式清洁工艺优化并集成到65nm制造流程中

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Miao Chun Lin; Mei Qi Wang; Joe Lai; Ren Huang; Cheng Ming Weng; J H Liao; Jianshe Tang; Ching Hwa Weng; Wei Lu; Han Wen Chen; John Tc Lee;
展开▼
作者单位

展开▼
年度 2015
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
专利

1. Metal Hard Mask Employed Cu/Low k Film post Ash and Wet Clean Process Optimization and Integration into 65nm Manufacturing Flow [J] . Miao Chun Lin, Mei Qi Wang, Joe Lai, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2008,第0期

机译：采用金属硬掩模的Cu / Low k膜过灰和湿法清洁工艺优化并整合到65nm制造流程中
2. Metal Hard Mask Employed Cu/Low k Film post Ash and Wet CleanProcess Optimization and Integration into 65nm Manufacturing Flow [J] . Miao Chun Lin, Mei Qi Wang, Joe Lai, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2008,第Null期

机译：采用金属硬掩模的Cu / Low k膜除灰和湿法清洁工艺优化并整合到65nm制造流程中
3. High-Performance Extremely Low-k Film Integration Technology with Metal Hard Mask Process for Cu Interconnects [J] . Torazawa Naoki, Matsumoto Susumu, Harada Takeshi, ECS Journal of Solid State Science and Technology . 2016,第10期

机译：用于铜互连的高性能极低k膜集成技术和金属硬掩模工艺
4. Metal Hard Mask Employed Cu/Low k Film post Ash and Wet Clean Process Optimization and Integration into 65nm Manufacturing Flow [C] . Miao Chun Lin, Mei Qi Wang, Joe Lai, International Symposium on Ultra Clean Processing of Silicon Surfaces . 2008

机译：金属硬面膜采用Cu /低k膜后灰和湿洁洁的工艺优化和整合到65nm制造流程中
5. Phase-selective synthesis of Tl-Ba-Ca-Cu-O thin films and multilayer structures by metal-organic chemical vapor deposition. Process optimization, phase evolution, electrical characterizations, and microstructural developments. [D] . McNeely, Richard Joseph. 1999

机译：通过金属有机化学气相沉积相选择合成Tl-Ba-Ca-Cu-O薄膜和多层结构。工艺优化，相变，电学表征和微结构发展。
6. Integration of Wet and Dry Bench Processes Optimizes Targeted Next-generation Sequencing of Low-quality and Low-quantity Tumor Biopsies [O] . Jeffrey Houghton, Andrew G. Hadd, Robert Zeigler, 2016

机译：湿法和干法工艺的集成优化了针对低质量和低数量肿瘤活检的下一代靶向测序
7. Aqueous Based Single Wafer Cu/Low-k Cleaning Process Characterization and Integration into Dual Damascene Process Flow [O] . Jianshe Tang, Brian J. Brown, Steven Verhaverbeke, 2015

机译：水基单晶硅Cu / Low-k清洗工艺表征与双镶嵌工艺流程的集成

Metal Hard Mask Employed Cu/Low k Film post Ash and Wet Clean Process Optimization and Integration into 65nm Manufacturing Flow

著录项

引文网络

相似文献

相关主题

期刊订阅