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Method and apparatus for real-time measurement of trace metal concentration in chemical mechanical polishing (CMP) slurry
Method and apparatus for real-time measurement of trace metal concentration in chemical mechanical polishing (CMP) slurry
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机译:实时测量化学机械抛光(CMP)浆料中痕量金属浓度的方法和设备
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摘要
A system (and method) for real-time measurement of trace metal concentration in a chemical mechanical polishing (CMP) slurry, includes an electromagnetic radiation flow cell carrying a CMP slurry, a slurry pickup head coupled to the flow cell, and an analyzer for measuring properties of the slurry flowing through the flow cell.
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