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Module assembly and method for stacked BGA packages
Module assembly and method for stacked BGA packages
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机译:堆叠式bga封装的模块组装和方法
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摘要
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.
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