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Module assembly for stacked BGA packages with a common bus bar in the assembly
Module assembly for stacked BGA packages with a common bus bar in the assembly
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机译:用于堆叠式BGA封装的模块组件,组件中具有公共母线
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摘要
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.
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