REFLOW HEATING METHOD, AND REFLOW HEATING DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent reflow soldering quality from lowering by reducing a deviation of a temperature profile in a reflow furnace even when a mounting substrate is mounted on some of a plurality of conveyance lanes provided in parallel in the reflow furnace and conveyed to be subjected to reflow heating.;SOLUTION: In the reflow furnace 11, the plurality of conveyance lanes 13 for conveying the mounting substrate 12 are provided in parallel, and when the mounting substrate 12 is mounted on some conveyance lane 13(L) and conveyed to be subjected to reflow heating, a dummy body 14 to be heated which has heat absorption characteristics (heat capacity, heat conductivity, etc.) similar to those of the mounting substrate 12 mounted on the conveyance lane 13(L) is mounted on the conveyance lane 13(R) where the mounting substrate 12 is not mounted, and conveyed. In this case, the dummy body 14 to be heated is formed so that the quantity of heat that the dummy body 14 to be heated absorbs in the reflow furnace 11 is nearly equal to the quantity of heat that the mounting substrate 12 absorbs.;COPYRIGHT: (C)2009,JPO&INPIT