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REFLOW HEATING TESTING DEVICE AND REFLOW HEATING TESTING METHOD

机译:回流加热测试装置及回流加热测试方法

摘要

PROBLEM TO BE SOLVED: To provide a device capable of conducting a heating test for evaluating the influence on various parts by the heating of a gas tank type solder reflow furnace.;SOLUTION: A preliminary heating tank 10 and a main heating tank 20 are provided. The reflow heating test of parts 7 to be tested in the same temperature transition as the temperature profile of the reflow furnace is performed by respectively soaking parts 7 to be tested in the heat medium liquids 13, 23 for the period corresponding to a preliminary heating section and a main heating section while maintaining the temperatures of heat medium liquids 13, 23 in the liquid tanks 10, 20 at the temperatures corresponding to a preliminary heating temperature and a main heating temperature decided by the temperature profile of the reflow furnace.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种能够进行加热测试的装置,以评估通过气罐式回流焊炉的加热对各个部件的影响。解决方案:提供预热罐10和主加热罐20 。通过在与预热段相对应的时间段内分别将待测部件7浸泡在热介质液体13、23中,在与回流炉温度曲线相同的温度转变下进行待测部件7的回流加热测试。 ;和一个主加热部分,同时将液罐10、20中的热介质液体13、23的温度保持在与预热温度和由回流炉的温度曲线决定的主加热温度相对应的温度。 (C)2005,日本特许厅

著录项

  • 公开/公告号JP2004286713A

    专利类型

  • 公开/公告日2004-10-14

    原文格式PDF

  • 申请/专利权人 SONY CORP;

    申请/专利号JP20030082439

  • 发明设计人 SHIRAISHI TSUNEJI;KAYAMA TATSUO;

    申请日2003-03-25

  • 分类号G01N3/60;

  • 国家 JP

  • 入库时间 2022-08-21 23:36:09

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