VIBRATING-REED CHIP, PIEZOELECTRIC VIBRATOR, AND METHOD OF MANUFACTURING VIBRATING-REED CHIP

摘要

PROBLEM TO BE SOLVED: To provide a vibrating-reed chip; a piezoelectric vibrator; and a method of manufacturing a vibrating-reed chip.;SOLUTION: An electrode pattern is formed on a wafer for a vibration element substrate; a bonding film of a solid-state bonding 18 is formed on the wafer for a vibration element substrate and a wafer for a holding substrate being a base of the wafer for a vibration element substrate; the wafer for a vibration element substrate is integrated with the wafer for a holding substrate by the bonding film by carrying out the solid-state bonding 18; and thereafter, a vibrating-reed chip 12 is formed into individual pieces by dicing it by leaving the lattice-like solid-state bonding 18 part and a region where at least a vibration element substrate 12a is brought into a cantilever state.;COPYRIGHT: (C)2009,JPO&INPIT