首页> 外国专利> MOUNTING CONDITION DETERMINING METHOD, MOUNTING CONDITION DETERMINING APPARATUS, COMPONENT MOUNTING METHOD, COMPONENT MOUNTER, AND PROGRAM

MOUNTING CONDITION DETERMINING METHOD, MOUNTING CONDITION DETERMINING APPARATUS, COMPONENT MOUNTING METHOD, COMPONENT MOUNTER, AND PROGRAM

机译:安装条件确定方法,安装条件确定设备,组件安装方法,组件安装器和程序

摘要

PROBLEM TO BE SOLVED: To provide a method for determining a component mounting condition that achieves enhanced area productivity while securing a high operating rate for every component mounter without suspending the component mounter even during setup change.;SOLUTION: A type-A board and a type-B board are respectively carried on an R-lane and an F-lane. In addition, the component mounting condition is determined such that mounters MC1 and MC2 mount components only on the type-A board, and mounter MC3 and MC4 mount components only on the type-B board.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种确定部件安装条件的方法,该方法可提高面积生产率,同时确保每个部件安装器的高工作率,即使在安装变更期间也无需暂停部件安装器。 B型板分别承载在R通道和F通道上。另外,确定组件的安装条件时,安装程​​序MC1和MC2仅将组件安装在A型板上,而安装程序MC3和MC4仅将组件安装在B型板上。版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2009224766A

    专利类型

  • 公开/公告日2009-10-01

    原文格式PDF

  • 申请/专利权人 PANASONIC CORP;

    申请/专利号JP20090020898

  • 发明设计人 MAENISHI YASUHIRO;AWATA YOSHIAKI;

    申请日2009-01-30

  • 分类号H05K13;H05K13/04;

  • 国家 JP

  • 入库时间 2022-08-21 19:43:41

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