CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND METHOD OF THE PACKAGE

摘要

PPROBLEM TO BE SOLVED: To provide a fan-out wafer level package structure that has no problem of mismatching caused by a coefficient of thermal expansion (CTE). PSOLUTION: The package structure comprises a substrate 2 with a die receiving through hole 4, a connecting through hole structure 22 and a first contact pad 3; a die 6 having a micro lens area 60 disposed in the die receiving through hole 4; a transparent cover 68 to cover the micro lens area 60; a surrounding material 24 formed under the die 6 and filled in the gap between the die 6 and sidewall of the die 6 receiving though hole 4; a dielectric layer 12 formed on the die 6 and the substrate 2; a re-distribution layer (RDL) 14 formed on the dielectric layer 12 and coupled to the first contact pad 3; a protection layer 26 formed over the RDL 14; a second contact pad 18 formed at the lower surface of the substrate 2 and under the connecting through hole structure 22; and a transparent base 68 formed on the protection layer 26. PCOPYRIGHT: (C)2009,JPO&INPIT