首页> 外国专利> METHOD FOR VAPOR-DEPOSITING METAL GATE ON HIGH-K DIELECTRIC FILM, METHOD FOR IMPROVING INTERFACE BETWEEN HIGH-K DIELECTRIC FILM AND METAL GATE, AND SUBSTRATE TREATMENT SYSTEM

METHOD FOR VAPOR-DEPOSITING METAL GATE ON HIGH-K DIELECTRIC FILM, METHOD FOR IMPROVING INTERFACE BETWEEN HIGH-K DIELECTRIC FILM AND METAL GATE, AND SUBSTRATE TREATMENT SYSTEM

机译:在高k介电薄膜上气相沉积金属栅极的方法,改善高k介电薄膜与金属栅极之间的界面的方法以及基体处理系统

摘要

PROBLEM TO BE SOLVED: To improve electrical properties and device performance by improving interface properties between a high-K dielectric film and a metal gate, in a metal-oxide film semiconductor field-effect transistor (MOSFET).;SOLUTION: The method for improving the interface between the high-K dielectric film and the metal gate in manufacturing the MOSFET by vapor-depositing the metal gate on the high-K dielectric body includes an annealing step to anneal the substrate with the high-K dielectric film vapor-deposited in a heat annealing module, and a vapor-depositing step to vapor-deposit metal gate material on the annealed substrate in a metal gate vapor-depositing module. The annealing step and the vapor-depositing step are executed successively without breaking a vacuum.;COPYRIGHT: (C)2009,JPO&INPIT
机译:要解决的问题:在金属氧化物膜半导体场效应晶体管(MOSFET)中,通过改善高K介电膜和金属栅极之间的界面性能来改善电性能和器件性能。解决方案:改进方法在通过在高K电介质体上气相沉积金属栅极来制造MOSFET的过程中,高K电介质膜与金属栅极之间的界面包括退火步骤,以对衬底进行气相沉积,以退火沉积在其中的高K电介质膜。加热退火模块,以及气相沉积步骤,以在金属栅极气相沉积模块中将金属栅极材料气相沉积在退火的基板上。退火步骤和气相沉积步骤是连续执行的,并且不会破坏真空。;版权所有:(C)2009,JPO&INPIT

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