Solid-state image pickup element package, semiconductor packages, camera module, and manufacturing method of the solid-state image pickup device package

摘要

PPROBLEM TO BE SOLVED: To provide the solid-state imaging device package, the semiconductor package, and the camera module which can prevent contamination, sticking of contamination and tarnish of a light receiving sensor region and a light transparent protection member, and to provide a manufacturing method of the solid-state imaging device package. PSOLUTION: The solid-state imaging device package comprises a solid-state imaging device 10a formed in a semiconductor wafer 1, a translucent protection member 3 which is disposed in opposition apart from the light receiving sensor region 4 of the solid-state imaging device 10a, and a sealant 5 which adheres and fixes the translucent protection member 3 and the surface of the semiconductor wafer 1 in the region except for the light receiving region. In the field region except for the light receiving region 4 in the semiconductor wafer 1, the package has one or a plurality of vent through-holes 11 passing through the semiconductor wafer 1, and a bottom lid insulating film 12a formed to close a back side of the semiconductor wafer 1 in the vent through-hole 11. PCOPYRIGHT: (C)2006,JPO&NCIPI