Kind of lead-free solder alloy low melting point

摘要

Regard to Sn-Zn-Bi-In-P based lead-free solder alloy in the technical area of ​​the electronic manufacturing and electronic materials, the weight percentage of each chemical component of the solder alloy is Zn4.0~12.0, Bi0.5~2.5, In0.5~ 5.0, P0.005~0.02, the rest is inevitable impurities and Sn. Or that dissolve and measured the metal material, the manufacturing process of lead-free solder alloy of the present invention in a furnace to melt and mix while heating the raw materials into the atmosphere. When excellent solder alloy produced in the present invention is a low melting point, melting point is 200 ℃ or less. The difference between the solid phase temperature and the liquidus temperature of the solder alloy is less than 3 ℃, it is possible to avoid quality problems of peeling for the welding point. To increase the bonding strength of welds, and be miniaturized and uniform texture. Thermal fatigue resistance is higher than the Sn-Pb eutectic alloy. Spreading rate of the solder alloy is close to that of the Sn-Pb eutectic solder alloy. Workability of the solder alloy is improved, to obtain various physical shapes, such as lines paste, powder, block, or bar are possible.