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Nitriding silicon/the grinding composition and the grinding method silicon dioxide removal speed ratio being high

机译:氮化硅/研磨组合物及研磨方法二氧化硅去除速度比高

摘要

This invention, the cation characteristic abrasives, the cation characteristic polymer, offers the inorganic halide salt, and the chemical machine grinding composition which includes the water carrier. This invention the baseplate chemistry furthermore offers the method of grinding mechanically making use of the aforementioned grinding composition. The grinding composition shows the selectivity in order compared to silicon dioxide and polysilicon to remove nitriding silicon.
机译:本发明是由阳离子特性磨料,阳离子特性聚合物,提供无机卤化物盐,以及包含水载体的化学机械研磨用组合物。本发明的底板化学物质还提供了利用上述研磨组合物进行机械研磨的方法。与除去氮化硅的二氧化硅和多晶硅相比,研磨组合物依次显示出选择性。

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