Method for depositing copper in lead-free solder, method for granulating and separating (CuX) 6Sn5-based compound, and method for recovering tin

摘要

An object of this invention is to isolate | separate the excess copper eluted in the lead-free solder tank, and to collect | recover tin efficiently. Add element X which forms (CuX) 6Sn5 compound between copper and tin to molten lead-free solder to precipitate (CuX) 6Sn5 compound, and pass it through a perforated plate in some cases Then, a vortex is applied to precipitate and separate the (CuX) 6Sn5 compound, and then the (CuX) 6Sn5 compound is extracted to recover tin.