METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CUX)6SN5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN

摘要

THE PURPOSE OF THE PRESENT INVENTION IS TO SEPARATE EXCESS COPPERS LEACHED OUT IN A LEAD-FREE SOLDER BATH AND RECOVER TIN WITH HIGH EFFICIENCY. AN ELEMENT X FOR FORMING A (CUX)6SN5 COMPOUND BETWEEN COPPER AND TIN IN MOLTEN LEAD-FREE SOLDERS IS ADDED TO SEPARATE OUT A (CUX)6SN5 COMPOUND. TIN IS RECOVERED BY BINDING THE (CUX)6SN5 COMPOUND BY PASSING THEREOF THROUGH A MULTI-PERFORATED PLATE, FURTHER GENERATING SWIRLING CURRENTS TO PRECIPITATE AND SEPARATE THE BOUND (CUX)6SN5 COMPOUNDS AND REMOVING THEREOF. FIGURE 1