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METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CuX)6Sn5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN
METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER, METHOD OF GRANULATING (CuX)6Sn5 COMPOUND AND METHOD OF SEPARATING THE SAME, AND METHOD OF RECOVERING TIN
The purpose of the present invention is to separate excess coppers leached out in a lead-free solder bath and recover tin with high efficiency. An element X for forming a (CuX) 6 Sn 5 compound between copper and tin in molten lead-free solders is added to separate out a (CuX) 6 Sn 5 compound. Tin is recovered by binding the (CuX) 6 Sn 5 compound by passing thereof through a multi-perforated plate, further generating swirling currents to precipitate and separate the bound (CuX) 6 Sn 5 compounds and removing thereof.
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机译:本发明的目的是分离在无铅焊料浴中浸出的过量铜,并以高效率回收锡。添加用于在熔融的无铅焊料中的铜和锡之间形成(CuX)6 Sn 5化合物的元素X,以分离出(CuX)6 Sn 5化合物。通过使(CuX)6 Sn 5化合物通过多孔板来结合锡,从而回收锡,进一步产生旋流,以沉淀和分离结合的(CuX)6 Sn 5化合物并除去。
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