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Method for depositing copper in lead-free solder, method for granulating and separating (CuX) 6Sn5-based compound, and method for recovering tin
Method for depositing copper in lead-free solder, method for granulating and separating (CuX) 6Sn5-based compound, and method for recovering tin
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机译:在无铅焊料中沉积铜的方法,用于成粒和分离(CuX)6Sn5的化合物的方法以及回收锡的方法
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摘要
The purpose of the present invention is to separate excess coppers leached out in a lead-free solder bath and recover tin with high efficiency. An element X for forming a (CuX) 6 Sn 5 compound between copper and tin in molten lead-free solders is added to separate out a (CuX) 6 Sn 5 compound. Tin is recovered by binding the (CuX) 6 Sn 5 compound by passing thereof through a multi-perforated plate, further generating swirling currents to precipitate and separate the bound (CuX) 6 Sn 5 compounds and removing thereof.
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机译:本发明的目的是分离在无铅焊料浴中浸出的过量铜,并以高效率回收锡。添加用于在熔融的无铅焊料中的铜和锡之间形成(CuX)6 Sn 5化合物的元素X,以分离出(CuX)6 Sn 5化合物。通过使(CuX)6 Sn 5化合物穿过多孔板来结合锡,从而回收锡,进一步产生旋流,以沉淀和分离结合的(CuX)6 Sn 5化合物并除去。
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