Manufacturability of SMD and Through-Hole Fuses Using Laser Process

摘要

The invention relates to a method of manufacturing a circuit protector and to a circuit protector. The method comprises the steps of providing a substrate having opposing end portions, coupling an element layer to the top surface of the substrate, and laser machining the element layer to shape the element layer into a predetermined geometry. The circuit protector comprises a substrate having opposing end portions, termination pads coupled to the top surface at opposing end portions of the substrate, a fuse element disposed across a space between the termination pads and electrically connecting the termination pads, the fuse element having a predetermined geometry; the predetermined geometry having the narrowest width of about 0.025 to about 0.050 millimeters, a cover coupling the top surface and suffusing the substrate, the fuse element and the termination pads, and end terminations in electrical contact with the termination pads at the opposing end portions.