Green wavelength laser processing of memory metal fuses

摘要

Metal fuses in redundancy circuitry can be laser repaired to enhance yield. However, shrinking IC design rules have necessitated fuse pitches smaller than the 2μm pitch lines that can be processed by traditional infrared lasers. Now metal fuse structures down to 1.0μm pitch can be cut using a newly developed, 532nm green-wavelength laser source on materials including poly-Si, W, and Al alloy. FIB/SEM observations and electrical measurements confirm that this is a viable production solution for the 65nm node and below.