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METHOD OF GRINDING WAFER

机译:晶圆研磨方法

摘要

A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.
机译:一种研磨晶片的方法,包括:晶片保持步骤,用于将晶片保持在具有保持表面的卡盘台的圆锥形保持表面上;粗研磨步骤,用于通过将粗研磨轮的研磨表面相对于所述卡盘台的保持表面以预定的倾斜角定位并旋转粗研磨来对保持在卡盘台的保持表面上的晶片进行粗研磨。轮;精研磨步骤,用于通过将精研磨轮的研磨表面平行于卡盘台的保持表面定位,并在砂轮的研磨区域中沿一定方向旋转精研磨轮来进行晶片的精研磨。朝着精磨轮的磨削表面和晶片要磨削的表面之间的接触角的顶点。

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