Provided are a holding jig which can eliminate troubles due to use of a protection sheet, a semiconductor wafer grinding method, a semiconductor wafer protecting structure, a semiconductor wafer grinding method using such semiconductor wafer protecting structure, and semiconductor chip manufacturing method. A holding jig (20) for holding a semiconductor wafer (W) is composed of a recessed hole (22) formed on the surface of a substrate (21); a plurality of supporting protrusions (23) arranged to protrude from the bottom surface of the recessed hole (22); a deformable adhesive film (24), which covers the recessed hole (22) by being supported by the supporting protrusions (23) and adhesively and removably holds the semiconductor wafer (W); and an exhaust path (25) for leading the air inside the recessed hole (22) covered with the adhesive film (24) to the external. ® KIPO & WIPO 2009
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