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Method for detecting Cu concentration of silicon substrate

机译:硅基板中铜浓度的检测方法

摘要

To expediently and quantitatively estimate Cu within a silicon substrate without fully dissolving the silicon substrate and to ascertain the process contamination, there is provided a method for quantitatively determining the Cu concentration in a Cu containing silicon substrate having obverse and converse surfaces, the silicon substrate contains at least 3×1018 atoms/cm3 of boron and is heated at a temperature of no more than 600° C., the improvement comprises heating the converse surface of the substrate at a temperature between 300° C. to 350° C. for a period of 1 to 12 hours and then quantitatively analyze the Cu concentration at obverse and converse surfaces of the heated substrate.
机译:为了在不完全溶解硅衬底的情况下方便且定量地估计硅衬底中的Cu并确定工艺污染,提供了一种用于定量确定具有正面和反面的含Cu硅衬底中Cu浓度的方法。至少3×10 18 原子/ cm 3 的硼,并在不超过600°C的温度下加热,所述改进包括加热硅的反面在300℃至350℃之间的温度下将基板加热1至12小时,然后定量分析加热基板的正面和反面的Cu浓度。

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