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Method of fabricating nitride-based compound layer, GaN substrate and vertical structure nitride-based semiconductor light emitting device

机译:氮化物基化合物层的制造方法,GaN衬底和垂直结构的氮化物基半导体发光器件

摘要

In a method for fabricating a nitride-based compound layer, first, a GaN substrate is prepared. A mask layer with a predetermined pattern is formed on the GaN substrate to expose a partial area of the GaN substrate. Then a buffer layer is formed on the partially exposed GaN substrate. The buffer layer is made of a material having a 10% or less lattice mismatch with GaN. Thereafter, the nitride-based compound is grown laterally from a top surface of the buffer layer toward a top surface of the mask layer and the nitride-based compound layer is vertically grown to a predetermined thickness. Also, the mask layer and the buffer layer are removed via wet-etching to separate the nitride-based compound layer from the GaN substrate.
机译:在用于制造氮化物基化合物层的方法中,首先,准备GaN衬底。具有预定图案的掩模层形成在GaN衬底上以暴露GaN衬底的部分区域。然后,在部分暴露的GaN衬底上形成缓冲层。缓冲层由与GaN具有10%或更少的晶格失配的材料制成。此后,从缓冲层的顶表面向掩模层的顶表面横向生长氮化物基化合物,并且将氮化物基化合物层垂直生长至预定厚度。另外,通过湿蚀刻去除掩模层和缓冲层,以使氮化物基化合物层与GaN衬底分离。

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