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CMOS device having different amounts of nitrogen in the NMOS gate dielectric layers and PMOS gate dielectric layers

机译:NMOS栅极介电层和PMOS栅极介电层中氮含量不同的CMOS器件

摘要

The present invention provides a complementary metal oxide semiconductor (CMOS) device, a method of manufacture therefor, and an integrated circuit including the same. The CMOS device (100), in an exemplary embodiment of the present invention, includes a p-channel metal oxide semiconductor (PMOS) device (120) having a first gate dielectric layer (133) and a first gate electrode layer (138) located over a substrate (110), wherein the first gate dielectric layer (133) has an amount of nitrogen located therein. In addition to the PMOS device (120), the CMOS device further includes an n-channel metal oxide semiconductor (NMOS) device (160) having a second gate dielectric layer (173) and a second gate electrode layer (178) located over the substrate (110), wherein the second gate dielectric layer (173) has a different amount of nitrogen located therein. Accordingly, the present invention allows for the individual tuning of the threshold voltages for the PMOS device (120) and the NMOS device (160).
机译:本发明提供了互补金属氧化物半导体(CMOS)器件,其制造方法以及包括该互补金属氧化物半导体的集成电路。在本发明的示例性实施例中,CMOS器件( 100 )包括具有第一栅极电介质的p沟道金属氧化物半导体(PMOS)器件( 120 )。层( 133 )和位于衬底( 110 )上方的第一栅电极层( 138 ),其中第一栅介质层(< B> 133 )中有一定量的氮。除了PMOS器件( 120 ),CMOS器件还包括具有第二栅极介电层( 160 )的n沟道金属氧化物半导体(NMOS)器件( 160 )。 173 )和位于衬底( 110 )上方的第二栅电极层( 178 ),其中第二栅介电层( 173 )中的氮含量不同。因此,本发明允许对PMOS器件( 120 )和NMOS器件( 160 )的阈值电压进行单独调整。

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