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Method for producing by vapour-phase epitaxy a gallium nitride film with low defect density

机译:通过气相外延制造具有低缺陷密度的氮化镓膜的方法

摘要

The invention concerns a method for preparing gallium nitride films by vapour-phase epitaxy with low defect densities. The invention concerns a method for producing a gallium nitride (GaN) film from a substrate by vapour-phase epitaxy deposition of gallium nitride. The invention is characterized in that the gallium nitride deposition comprises at least one step of vapour-phase epitaxial lateral overgrowth, in that at least one of said epitaxial lateral overgrowth steps is preceded by etching openings either in a dielectric mask previously deposited, or directly into the substrate, and in that it consists in introducing a dissymmetry in the environment of dislocations during one of the epitaxial lateral overgrowth steps so as to produce a maximum number of curves in the dislocations, the curved dislocations not emerging at the surface of the resulting gallium nitride layer. The invention also concerns the optoelectronic and electronic components produced from said gallium nitride films.
机译:本发明涉及一种通过气相相外延制备具有低缺陷密度的氮化镓膜的方法。本发明涉及一种通过气相氮化镓的气相外延沉积从衬底制备氮化镓(GaN)膜的方法。本发明的特征在于,氮化镓沉积包括至少一个汽相外延横向过长的步骤,其中所述外延横向过长步骤中的至少一个步骤是在先前沉积的电介质掩模中刻蚀开口,或者直接蚀刻到开口中。衬底,其在于在于在外延横向过度生长步骤之一中在位错环境中引入不对称性,从而在位错中产生最大数量的弯曲,弯曲的位错不会在所得镓的表面上出现氮化物层。本发明还涉及由所述氮化镓膜制成的光电和电子部件。

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