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METHOD FOR PRODUCING BY VAPOUR-PHASE EPITAXY A GALLIUM NITRIDE FILM WITH LOW DEFECT DENSITY

机译:气相滴定法制备低密度氮化镓膜的方法

摘要

The present invention relates to the production of films of gallium nitride by vapour phase epitaxy with low densities of defects. It relates to a process for the production of a film of gallium nitride (gan) from a substrate, by deposition of gan by vapour phase epitaxy, characterized in that the deposition of gan comprises at least one step of epitaxial lateral overgrowth (elo) in the vapor phase, that at least one of these steps of elo is preceded by an etching of openings or in a dielectric mask deposited beforehand, either directly in the substrate, and in that it is introduced a dissymmetry in the environment of the dislocations during the steps of elo so as to cause the largest number of curvature of the dislocations, the dislocations curved does not protrude on the surface of the layer of gan thus obtenue.elle also concerns the optoelectronic and electronic components produced from these films of gallium nitride.
机译:本发明涉及通过气相外延具有低缺陷密度的氮化镓膜的生产。本发明涉及通过气相外延通过沉积GaN而从衬底生产氮化镓(gan)膜的方法,其特征在于,gan的沉积包括至少一个步骤:外延横向过生长(elo)。在气相中,在这些步骤中的至少一个步骤之前,是直接在基板上蚀刻开口或在预先沉积的介电掩模中进行蚀刻,或者直接在衬底中引入了不对称性。为了引起最大程度的位错曲率,弯曲的位错不会在gan层的表面上突出,因此不会变硬。elle还涉及由这些氮化镓薄膜制成的光电和电子组件。

著录项

  • 公开/公告号EP1525340A2

    专利类型

  • 公开/公告日2005-04-27

    原文格式PDF

  • 申请/专利权人 LUMILOG;

    申请/专利号EP20030750838

  • 申请日2003-07-24

  • 分类号C30B25/02;

  • 国家 EP

  • 入库时间 2022-08-21 22:07:46

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