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High performance field effect transistors on SOI substrate with stress-inducing material as buried insulator and methods

机译:以应力诱导材料为掩埋绝缘体的SOI衬底上的高性能场效应晶体管及方法

摘要

The present invention provides a semiconductor structure that includes a high performance field effect transistor (FET) on a semiconductor-on-insulator (SOI) in which the insulator thereof is a stress-inducing material of a preselected geometry. Such a structure achieves performance enhancement from uniaxial stress, and the stress in the channel is not dependent on the layout design of the local contacts. In broad terms, the present invention relates to a semiconductor structure that comprises an upper semiconductor layer and a bottom semiconductor layer, wherein said upper semiconductor layer is separated from said bottom semiconductor layer in at least one region by a stress-inducing insulator having a preselected geometric shape, said stress-inducing insulator exerting a strain on the upper semiconductor layer.
机译:本发明提供了一种半导体结构,其包括在绝缘体上半导体(SOI)上的高性能场效应晶体管(FET),其中,其绝缘体是预选几何形状的应力诱导材料。这种结构通过单轴应力实现了性能增强,并且通道中的应力不依赖于局部触点的布局设计。广义上讲,本发明涉及一种半导体结构,其包括上半导体层和下半导体层,其中所述上半导体层在至少一个区域中通过具有预选应力的绝缘体与所述下半导体层隔开。所述应力诱导绝缘体在几何形状上对上部半导体层施加应变。

著录项

  • 公开/公告号US7528050B2

    专利类型

  • 公开/公告日2009-05-05

    原文格式PDF

  • 申请/专利权人 JUDSON R. HOLT;QIQING C. OUYANG;

    申请/专利号US20080115106

  • 发明设计人 JUDSON R. HOLT;QIQING C. OUYANG;

    申请日2008-05-05

  • 分类号H01L21/46;

  • 国家 US

  • 入库时间 2022-08-21 19:29:12

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