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Electrical characterization of wafer-bonded Ge(111)-on-insulator substrates using four-point-probe pseudo-metal-oxide-semiconductor field-effect transistor method

机译:使用四点探针伪金属氧化物半导体场效应晶体管方法对绝缘体上Ge(111)晶片粘结的电特性进行表征

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摘要

The electrical properties of wafer-bonded n-type Ge(111)-on-insulator (Ge(111)-O1) substrates were characterized using a four-point-probe pseudo-metal-oxide-semiconductor field-effect transistor (pseudo-MOSFET) method. Average electron and hole mobilities in the Ge(111)-O1 channel were measured to be ~1000cm~2/Vs in accumulation mode and ~310cm~2/Vs in inversion mode, respectively. The measured mobility strongly depended on the sample position, due to the spatially inhomogeneous distribution of the interface states. Despite the existence of interface states, the carrier mobility exhibited a high value demonstrating the prospect of waferbonded Ge( 111 )-01 as a channel material in MOSFETs.
机译:使用四点伪金属氧化物半导体场效应晶体管(pseudo-probe)来表征与晶片结合的绝缘体上的n型Ge(111)-衬底(Ge(111)-O1)的电性能。 MOSFET)方法。 Ge(111)-O1通道的平均电子迁移率和空穴迁移率在累积模式下分别约为1000cm〜2 / Vs,在反型模式下约为310cm〜2 / Vs。由于界面态在空间上的不均匀分布,因此测得的迁移率很大程度上取决于样品的位置。尽管存在界面态,但载流子迁移率仍显示出很高的值,这证明了将晶圆键合的Ge(111)-01用作MOSFET中的沟道材料的前景。

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  • 来源
    《Thin Solid Films》 |2012年第8期|p.3232-3235|共4页
  • 作者单位

    Graduate School of Engineering Science, Osaka University, Toyonaka, Osaka 560-8537, Japan;

    Graduate School of Engineering Science, Osaka University, Toyonaka, Osaka 560-8537, Japan,PRESTO, JST, Saitama, 332-0012, Japan;

    Graduate School of Engineering Science, Osaka University, Toyonaka, Osaka 560-8537, Japan;

    Graduate School of Engineering Science, Osaka University, Toyonaka, Osaka 560-8537, Japan;

    Graduate School of Engineering Science, Osaka University, Toyonaka, Osaka 560-8537, Japan;

    Covalent Silicon Co., Ltd., Seirou, Kitakanbara-gun, Niigata 957-0197, Japan;

    Graduate School of Engineering Science, Osaka University, Toyonaka, Osaka 560-8537, Japan;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    germanium-on-insulator; wafer bonding; pseudo-MOSFET;

    机译:绝缘体上锗晶圆键合;伪MOSFET;

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