HIGH DENSITY AREA ARRAY SOLDER MICROJOINING INTERCONNECT STRUCTURE AND FABRICATION METHOD

摘要

A system for interconnecting a set of device chips by means of an array ofmicrojoints disposed on an interconnect carrier is taught. The carrier isprovided with a dense array of microjoint receptacles with an adhesion layer,barrier layer and a noble metal layer; the device wafers are fabricated withan array of microjoining pads comprising an adhesion layer, barrier layer anda fusible solder layer with pads being located at matching locations inreference to the barrier receptacles; said device chips are joined to saidcarrier through the microjoint arrays resulting in interconnections capable ofvery high input/output density and inter-chip wiring density.