首页> 外国专利> STRUCTURE FOR ATTACHING COMPONENT HAVING HEATING BODY MOUNTED THEREON

STRUCTURE FOR ATTACHING COMPONENT HAVING HEATING BODY MOUNTED THEREON

机译:固定有加热体的组件的固定结构

摘要

Provided is a structure for attaching a component having a heating body mounted thereon, wherein sizes are reduced and heat dissipating efficiency is improved by improving heat conduction efficiency. A plurality of protruding sections are formed on an attaching surface of a base plate (10), and the base plate (10) is attached to a heat dissipating member (17) by arranging a heat conductive sheet (18) formed of a material softer than the base plate (10) in between.
机译:提供一种用于附接其上安装有加热体的部件的结构,其中,通过提高热传导效率,减小了尺寸并提高了散热效率。在基板(10)的安装面上形成有多个突出部,通过配置由较软的材料形成的导热片(18),将基板(10)安装于散热构件(17)。比介于两者之间的基板(10)。

著录项

  • 公开/公告号WO2009110045A1

    专利类型

  • 公开/公告日2009-09-11

    原文格式PDF

  • 申请/专利权人 KABUSHIKI KAISHA TOSHIBA;HASEGAWA TSUYOSHI;

    申请/专利号WO2008JP03685

  • 发明设计人 HASEGAWA TSUYOSHI;

    申请日2008-12-10

  • 分类号H01L23/36;H05K7/20;

  • 国家 WO

  • 入库时间 2022-08-21 19:17:01

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号