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LEADFRAME FOR PACKAGED ELECTRONIC DEVICE WITH ENHANCED MOLD LOCKING CAPABILITY
LEADFRAME FOR PACKAGED ELECTRONIC DEVICE WITH ENHANCED MOLD LOCKING CAPABILITY
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机译:具有增强的模具锁定功能的封装式电子设备的引线框架
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摘要
A packaged electronic device (20) includes a die pad (30), leads (32) arranged around the die pad (30), and a die (24) attached to an upper surface (34) of the die pad (30) and electrically connected to the leads (32). A packaging material (28) encapsulates the die pad (30), the die (24), and the leads (32). The die pad (30) includes indentations (42) formed in the upper surface (34) along a sidewall (38) of the die pad (30). The die pad (30) further includes indentations (44) formed in a lower surface (36) of the die pad (30) along the sidewall. The packaging material (28) fills the indentations (42, 44) thereby promoting adhesion between the die pad (30) and the packaging material (28) so that the die pad (30) and packaging material (28) cannot readily delaminate.
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