MORPHOLOGICAL FORMS OF FILLERS FOR ELECTRICAL INSULATION

摘要

A high thermal conductivity resin that has a host resin matrix, and a high thermal conductivity filler. The high thermal conductivity filler (30) forms a continuous organic-inorganic composite with the host resin matrix. The fillers are from 1-1000 nm in length, and have average aspect ratios of between 3-100. At least a portion of the high thermal conductivity fillers comprise morphologies (31) chosen from one or more of hexagonal, cubic, orthorhombic, rhombohedral, tetragonal, whiskers and tubes. In particular, some of the fillers will aggregate into secondary structures.