BATCH-TYPE ATOMIC LAYER DEPOSITION APPARATUS AND ATOMIC LAYER DEPOSITION METHOD USING THE SAME

摘要

A batch-type atomic layer deposition apparatus and method are provided to improve the fabrication efficiency by progressing a unit process of atomic layer deposition on a plurality of wafers at a time. A batch-type atomic layer deposition apparatus comprises a housing separating inside and outside, an interior support wall(110) installed concentrically inside the housing with a gap from the housing, a ring-shaped base plate(120) which is pivotally installed between the housing and interior support wall and in which a plurality of wafers are mounted(202,204,208), and a plurality of separation units which are removably installed on the base plate in the circumferential direction. At least one pair of reaction chambers(122,124,126,128) are made of the housing, the interior support wall, the base plate and the separation unit. As the base plate is successively rotated corresponding to the reaction chamber pair, a unit process corresponding to the reaction chamber is successively progressed on each wafer.