A method for controlling parallelism of a bonding tool in a bonding device is provided to reduce the delay of a bonding process by reducing a working time to match the parallelism of the bonding tool and the bonding stage. The parallelism between a bonding tool absorbing a chip and a bonding stage supporting the chip is controlled within the predetermined range. Reference points are set up in the bonding stage and the bonding tool. A distance between the reference position of the bonding tool and the pressured position of the bonding tool is inputted as the reference data by pressurizing an arbitrary reference point of the bonding tool to the preset pressure of the arbitrary reference point of the bonding stage. The distance between the reference position of the bonding tool and the pressured position of the bonding tool is compared with the reference data. The parallelism of the bonding tool and the bonding stage is controlled according to the comparison result.
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