首页> 外国专利> INJECTIN MOLDING SOLDER APPARATUS FOR PREVENTING CAVITY GENERATION DURING INJECTION OF MOLTEN SOLDER INTO SUBSTRATE AND METHOD THEREOF

INJECTIN MOLDING SOLDER APPARATUS FOR PREVENTING CAVITY GENERATION DURING INJECTION OF MOLTEN SOLDER INTO SUBSTRATE AND METHOD THEREOF

机译:用于防止在将熔融焊料注入基质中的型腔产生的注射成型焊料装置及其方法

摘要

A molten solder injection apparatus for preventing generation of cavities during a process for injecting solders into a substrate and an injecting method thereof are provided to perform stably and effectively a molten solder injection process by maintaining easily a state of low pressure or a state of vacuum of a receiving part of a substrate. A solder injection apparatus(100) injects solders into a substrate(10) having a receiving part for receiving molten solders. The solder injection apparatus includes a solder storage unit(111), a solder receiving chamber(I), and absorbing unit. The solder storage unit stores the molten solders. The solder receiving chamber is connected with the solder storage unit in order to receive the molten solders. The solder receiving chamber is in contact with the substrate in order to fill the molten solders in the receiving part through an outlet formed at a bottom surface. The absorbing unit maintain a low-pressure state of a front region of a front barrier rib in comparison with a pressure state of a peripheral region of the front barrier rib. The receiving part is filled with the molten solders according to a transferring operation of the solder receiving chamber in the low-pressure state.
机译:提供一种用于防止在将焊料注入到基板中的过程中产生空穴的熔融焊料注入装置及其注入方法,以通过容易地保持低压状态或真空状态来稳定且有效地执行熔融焊料注入过程。基板的接收部分。焊料注入装置(100)将焊料注入具有用于容纳熔融焊料的容纳部的基板(10)中。焊料注入装置包括焊料存储单元(111),焊料容纳室(I)和吸收单元。焊料存储单元存储熔融的焊料。焊料容纳室与焊料存储单元连接,以便容纳熔化的焊料。焊料容纳室与基板接触,以便通过形成在底表面处的出口将熔融焊料填充在容纳部中。与前阻挡肋的周边区域的压力状态相比,吸收单元保持前阻挡肋的前区域的低压状态。在低压状态下,根据焊料容纳室的传送操作,容纳部分填充有熔融焊料。

著录项

  • 公开/公告号KR20090078278A

    专利类型

  • 公开/公告日2009-07-17

    原文格式PDF

  • 申请/专利权人 KOREA SEMICINDUCTOR SYSTEM CO. LTD.;

    申请/专利号KR20080004138

  • 发明设计人 LEE SEUNG WOO;

    申请日2008-01-14

  • 分类号H01L23/488;H01L21/60;

  • 国家 KR

  • 入库时间 2022-08-21 19:12:56

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