COATING METHOD OF EPOXY RELEASE WAX ON CHIP PACKAGE MOLD AND THEREBY SUITABLE COATING SEAT

摘要

about The present invention relates to a method and therefore suitable for applying the epoxy coated sheet for chip packaging mold release wax as, more particularly, to a method for applying an epoxy mold release wax in one-chip packaging to be coated with the epoxy in the mold release wax effectively for the packaging in order to prevent the epoxy from sticking when creating a package of a semiconductor chip with an epoxy, and This relates to a sheet for the coating. ; is an object of the present invention, chip packaging operations in the bag to reduce the operation time of the operation for applying the wax to the cavity of the upper and lower mold as well as the operator and improves the working efficiency and thus to provide a method for coating a sheet for this is to facilitate the task of removing the wax coating agent is applied by hand the epoxy mold release wax to remove the risk of chip packaging. ; achieve the above object sheet is applied according to the invention to a fiber material having a degree of addition would not get soon as the heat resistance temperature of the mold by making a chip packaging for the upper and lower molds (55, 53) of the cover at the same time enough abutted surface of the size, and making the support portion (1), which is uniformly applied to said one support (1) characterized in that it consists of epoxy wax release agent (2). ; In addition, the method according to the invention , the top surface of the chip the upper and lower mold for packaging (55, 53) in contact with the release agent as well as epoxy soon as the wax produced by the surface large enough to cover all at once in the (2) are uniformly lower mold the support (1) coated with 53 the steps of the seating so as to cover the whole, ; the upper mold 55 downward by the support (1) when secured to the steps of pressing the one support (2) is the lower mold (53), ; is the one when the support (1) presses the support positioned in the cavity (51) (1) is filled inside the cavity (51) characterized in that it consists of applying a wax (2) .