COATING METHOD OF EPOXY RELEASE WAX ON CHIP PACKAGE MOLD AND THEREBY SUITABLE STRUCTURE

摘要

About being therefore suitable for using the epoxy coated piece for chip package mould release wax the present invention relates to a kind of method because being used to applying an epoxy resin pattern in the packaging of monolithic to discharge epoxy resin that wax is effectively coated in mould release wax for packing more specifically to a kind of method to prevent epoxy resin from clinging, when creating the semiconductor chip of packet one by one with an epoxy resin, this is related to for a piece of of coating. ;It is the purpose of the present invention, chip packaging operation reduces the operation time of operation in bag, it its cavity for being used to for wax being applied to upper and lower mould and operator and improves working efficiency and therefore provides a kind of method, be that promote the task of removal wax coating agent be risk that applied by hand epoxy resin pattern discharges wax removal chip package for being coated a piece of for this. ;Reach above-mentioned purpose piece according to the present invention will not obtain by manufacturing the upper and lower molds (55 for lid the fibrous material with increase degree as the heat resistance temperature of mould by application quickly, 53) enough abutted surfaces of chip package while size, it manufactures support portion (1), is uniformly applied to a support (1) it is characterized in that it includes the wax releasing agent (2) of epoxy. ;Furthermore, according to the method for the present invention, the top surface upper and lower mould of chip, it is used to contact encapsulation (55 with interleaving agent, 53) and epoxy is quickly that lower mold support (1) is coated with 53 step seat to cover entirety by sufficiently large cover suddenly equably in (2) that surface generates as wax;The downward upper mold 55 by support (1) when being fixed to step and that is pressed to support (2) is lower mold (53),;What the support that is that when support (1) pressure was positioned at cavity (51) (1) is filled with cavity (51) it is characterized in that it includes using a wax (2).