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METHOD AND APPARATUS FOR LOW TEMPERATURE PYROMETRY USEFUL FOR THERMALLY PROCESSING SILICON WAFERS

机译:用于硅晶片热处理的低温热解的方法和装置

摘要

Rapid heat treatment processing (RTP) system (110) including a transmission pyrometer (12) monitoring the temperature dependent absorption of the silicon wafer 32 with respect to the radiation from the RTP lamps (46) at a reduced power level. The value of the un-normalized photodetector photocurrent produced a lookup table that associates the lamp and wafer temperature and copying. Correction step (170) measures the photocurrent with known wafer and lamp temperature, all photocurrent screen normalized measured thereafter 142. Transmission pyrometer may be used in the pre-heating step for a high temperature process including a can be used for closed-loop control for the heat treatment of less than 500 ℃, copy or pyrometer in a closed-loop control. Pre-heating temperature ramp rate could be measured and controlled by the initial sangseungryulreul readjust the lamp power accordingly. Copying and transmission pyrometers may be included in the integrated structure 190, with the beam-splitter 204 for splitting the radiation from the wafer.
机译:快速热处理处理(RTP)系统(110)包括透射高温计(12),该高温计以降低的功率水平监视硅晶片32相对于来自RTP灯(46)的辐射的温度依赖性吸收。未归一化的光电探测器光电流的值产生了一个查找表,该表将灯和晶片的温度以及复制相关联。校正步骤(170)在已知晶片和灯的温度下测量光电流,此后对所有光电流屏进行归一化测量(142)。透射高温计可用于高温过程的预热步骤,包括可用于闭环控制。低于500℃的热处理,在闭环控制下复制或高温计。可以通过初始sangseungryulreul来重新调节灯功率,从而测量和控制预热温度的上升速率。复制和透射高温计可以包括在集成结构190中,分束器204用于分离来自晶片的辐射。

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