首页> 外国专利> Thermosetting Resin Composition, Resin Film, Metal Foil with Insulating Material, Insulating Film with Metal Foil on Each Side, Metal-Clad Laminate, Multilayered Metal-Clad Laminate, and Multilayered Printed Circuit Board

Thermosetting Resin Composition, Resin Film, Metal Foil with Insulating Material, Insulating Film with Metal Foil on Each Side, Metal-Clad Laminate, Multilayered Metal-Clad Laminate, and Multilayered Printed Circuit Board

机译:热固性树脂组合物,树脂膜,带绝缘材料的金属箔,两面带金属箔的绝缘膜,覆金属层压板,多层覆金属层压板和多层印刷电路板

摘要

A process for producing a silicone polymer comprising a step of subjecting, to hydrolysis and polycondensation reaction, a silane compound mixture containing 35 to 100% by mol of a silane compound represented by the general formula (I): R'm(H)kSiX4-(m+k) (wherein X is a hydrolysable and polycondensable group, e.g., a halogen atom (e.g., chlorine or bromine) or -OR; R is an alkyl group of 1 to 4 carbon atoms or an alkyl carbonyl group of 1 to 4 carbon atoms; R' is a non-reactive group, e.g., an alkyl group of 1 to 4 carbon atoms or an aryl group (e.g., a phenyl group); "k" is 1 or 2; "m" is 0 or 1; and "m+k" is 1 or 2), and further subjecting the resultant product to hydrosilylation reaction with a hydrosilylation agent.
机译:有机硅聚合物的制造方法,其特征在于,使含有35〜100摩尔%的通式(I)所示的硅烷化合物的硅烷化合物混合物进行水解和缩聚反应:R’m(H)kSiX4 -(m + k)(其中X是可水解和可缩合的基团,例如卤素原子(例如氯或溴)或-OR; R是1-4个碳原子的烷基或1个烷基的羰基)碳原子数为1〜2的碳原子; R’为非反应性基团,例如碳原子数为1〜4的烷基或芳基(例如苯基);“ k”为1或2;“ m”为0或1;和“ m + k”为1或2),并且进一步使所得产物与氢化硅烷化剂进行氢化硅烷化反应。

著录项

  • 公开/公告号KR100890313B1

    专利类型

  • 公开/公告日2009-03-26

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20087010713

  • 申请日2008-05-02

  • 分类号C08L83;C08G77;C08K3/34;C08L91;

  • 国家 KR

  • 入库时间 2022-08-21 19:12:06

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