首页> 外国专利> THERMOSETTING RESIN COMPOSITION, RESIN FILM, METAL FOIL WITH INSULATING MATERIAL, INSULATING FILM WITH METAL FOIL ON EACH SIDE, METAL-CLAD LAMINATE, MULTILAYERED METAL-CLAD LAMINATE, AND MULTILAYERED PRINTED CIRCUIT BOARD

THERMOSETTING RESIN COMPOSITION, RESIN FILM, METAL FOIL WITH INSULATING MATERIAL, INSULATING FILM WITH METAL FOIL ON EACH SIDE, METAL-CLAD LAMINATE, MULTILAYERED METAL-CLAD LAMINATE, AND MULTILAYERED PRINTED CIRCUIT BOARD

机译:热固性树脂组成,树脂膜,带绝缘材料的金属箔,在每侧与金属箔绝缘的膜,金属包覆层板,多层金属包覆层板和多层印刷电路板

摘要

A process for producing a silicone polymer, characterized by hydrolyzing/condensation-polymerizing one or more silane compounds comprising 35 to 100 mol% silane compound represented by the formula (I): R'm(H)kSiX4-(m+k)[wherein X represents a group capable of undergoing hydrolysis and polycondensation, such as halogeno, e.g., chlorine or bromine, or -OR (wherein R represents C1-4 alkyl or C1-4 alkylcarbonyl); R' represents a nonreactive group such as C1-4 alkyl or aryl, e.g., phenyl; and k is 1 or 2 and m is 0 or 1, provided that m+k is 1 or 2] and subjecting the resultant reaction product to hydrosilylation with a hydrosilylating agent.
机译:一种有机硅聚合物的生产方法,其特征在于,水解/缩聚一种或多种包含由式(I)表示的35至100mol%硅烷化合物的硅烷化合物:R'm(H)kSiX4-(m + k)[其中X代表能够进行水解和缩聚的基团,例如卤代,例如氯或溴,或-OR(其中R代表C 1-4烷基或C 1-4烷基羰基); R'代表非反应性基团,例如C1-4烷基或芳基,例如苯基; [式中,k为1或2,m为0或1,条件是m + k为1或2],将所得的反应产物用氢化硅烷化剂进行氢化硅烷化。

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