首页> 外国专利> VACUUM PROCESSING CHAMBER SUITABLE FOR ETCHING HIGH ASPECT RATIO FEATURES AND COMPONENTS OF SAME

VACUUM PROCESSING CHAMBER SUITABLE FOR ETCHING HIGH ASPECT RATIO FEATURES AND COMPONENTS OF SAME

机译:真空处理室,适用于蚀刻高纵横比特征和相同部件

摘要

Embodiments of the invention provide a method and apparatus, such as a processing chamber, suitable for etching high aspect ratio features. Other embodiments include a showerhead assembly for use in the processing chamber. In one embodiment, a processing chamber includes a chamber body having a showerhead assembly and substrate support disposed therein. The showerhead assembly includes at least two fluidly isolated plenums, a region transmissive to an optical metrology signal, and a plurality of gas passages formed through the showerhead assembly fluidly coupling the plenums to the interior volume of the chamber body. Other components suitable for use in the processing chamber are also provided.
机译:本发明的实施例提供一种适合于蚀刻高深宽比特征的方法和设备,例如处理室。其他实施例包括用于处理室中的喷头组件。在一个实施例中,处理腔室包括腔室主体,该腔室主体具有喷头组件和设置在其中的基板支撑件。莲蓬头组件包括至少两个流体隔离的气室,可透射光学计量信号的区域,以及穿过莲蓬头组件形成的多个气体通道,这些气体通道将气室流体地耦合到腔室主体的内部容积。还提供了适用于处理室的其他部件。

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