Rotor disk, a process for the coating of a rotor disk, as well as a process for the simultaneous two-side material abrasive machining of semiconductor wafers

摘要

The invention relates to a rotor disk, suitable for receiving one or more semiconductor wafers to their processing in läpp -, - of the grinding or polishing machines, comprising a core of a first material, which has a high rigidity, the completely or partially with a second material is coated, as well as at least one recess for receiving a semiconductor wafer, characterized in that the second material in the form of a thermoset polyurethane - elastomer with a hardness of 20 - 90 according to shore a is. In addition, the invention relates to a process for the coating of rotor disks and a method for the simultaneous two-side material abrasive machining of a plurality of semiconductor wafers with the use of such rotor disks.