Rotor disk set forming method for polishing semiconductor wafer, involves selecting one rotor disk based on material properties for rotor disk set, where characterization of selected rotor disk is marked by engraving identification mark

摘要

The method involves determining material properties of rotor disks, and selecting one of the rotor disks based on the material properties for a rotor disk set. The material properties are determined by measuring or testing the rotor disks. Characterization of the selected rotor disk is marked by engraving an identification mark. The rotor disks are coated with a coating of diamond-like carbon. Marking of the rotor disks is updated in a case of selection of the rotor disks.