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Semiconductor chip package, semiconductor chip package, and method of manufacturing a device
Semiconductor chip package, semiconductor chip package, and method of manufacturing a device
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机译:半导体芯片封装,半导体芯片封装以及制造装置的方法
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摘要
A method for manufacturing a device, a semiconductor chip package, and a semiconductor chip package is disclosed. One embodiment involves applying at least one semiconductor chip to a first mold element. At least one element is applied to a second mold element. A material is deposited on the at least one semiconductor chip and on the at least one element.
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