首页> 外国专利> COMPONENT MOUNTING SYSTEM, METHOD OF MOUNTING COMPONENT, CIRCUIT BOARD PASTED STATE DETECTING DEVICE, OPERATING CONDITION DATA PREPARATION DEVICE, CIRCUIT BOARD PASTING DEVICE, COMPONENT MOUNTING DEVICE, AND INSPECTING DEVICE

COMPONENT MOUNTING SYSTEM, METHOD OF MOUNTING COMPONENT, CIRCUIT BOARD PASTED STATE DETECTING DEVICE, OPERATING CONDITION DATA PREPARATION DEVICE, CIRCUIT BOARD PASTING DEVICE, COMPONENT MOUNTING DEVICE, AND INSPECTING DEVICE

机译:组件安装系统,组件安装方法,电路板粘贴状态检测设备,操作数据准备设备,电路板粘贴设备,组件安装设备和检查设备

摘要

PROBLEM TO BE SOLVED: To provide a component mounting system capable of suppressing the occurrence of mounting failures when mounting a component by pasting a circuit board to a jig.;SOLUTION: This component mounting system 1 includes a circuit board pasting device 200, a solder printing machine 300 which detects the pasted state of an FPC 2 with respect to the jig 3, prepares operating condition data based on the pasted state, and prints solder on the FPC 2 through a mask 350, a component mounting device 400, and a management computer 700. The management computer 700 is structured so as to apply feedback control to correct a pasted position when pasting the FPC 2 to the jig 3, and control to correct a mounting position when mounting the component on the FPC 2 to the circuit board pasting device 200 or the component mounting device 400, based on the operating condition data.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种部件安装系统,该部件安装系统能够通过将电路板粘贴到夹具上来抑制在安装部件时发生安装故障。解决方案:该部件安装系统1包括电路板粘贴装置200,焊料印刷机300,其检测FPC 2相对于夹具3的粘贴状态,基于粘贴状态准备操作条件数据,并通过掩模350,部件安装装置400和管理装置将焊料印刷在FPC 2上管理计算机700被构造为在将FPC 2粘贴到夹具3时应用反馈控制以校正粘贴位置,并且在将FPC 2上的组件安装到电路板粘贴时进行控制以校正安装位置。设备200或组件安装设备400,基于操作条件数据。;版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2010056143A

    专利类型

  • 公开/公告日2010-03-11

    原文格式PDF

  • 申请/专利权人 YAMAHA MOTOR CO LTD;

    申请/专利号JP20080216834

  • 发明设计人 FUJI SHOJI;TANAKA NAOFUMI;

    申请日2008-08-26

  • 分类号H05K13/04;H05K13/08;

  • 国家 JP

  • 入库时间 2022-08-21 19:05:32

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