COMPONENT MOUNTING SYSTEM, METHOD FOR MOUNTING COMPONENT, CIRCUIT BOARD PASTED STATE DETECTING DEVICE, PRINTING CONDITION DATA PREPARING DEVICE, AND PRINTING MACHINE

摘要

PROBLEM TO BE SOLVED: To provide a component mounting system capable of suppressing the occurrence of printing failures, when the position of a circuit board is out of place with respect to a jig.;SOLUTION: This component mounting system 1 includes a circuit board pasting device 200 which pastes a plurality of FPCs 2 onto the jig 3, a solder printing machine 300 which detects a pasted state including positions where each of a plurality of the FPCs 2 is pasted to the jig 3, prepares printing condition data based on the pasted state, and prints solder on the FPC 2 through a mask 350 based on the printing condition data, and a component mounting device 400 which mounts components to the FPC 2 on which solder is printed. The solder printer 300 is structured so as to correct the position of the jig 3 with respect to the mask 350 when performing printing, based on the printing condition data.;COPYRIGHT: (C)2010,JPO&INPIT