A method to predict the thermal performance of printed circuit board mounted solid state devices

摘要

The objective was to formulate a design procedure to be used in the prediction of the thermal performance of printed circuit board mounted solid state devices (specifically 14 and 16 pin DIP's and TO-3 and TO-66 transistor cases). The project consists of an analytical phase which constitutes the actual formulation of the design procedure in the form of a digital computer program with appropriate documentation and an experimental phase which involves testing of actual P-C boards to verify the analytical model