Method for manufacturing mixed printed circuit board of measuring device, involves printing stencil with solder paste, and fitting surface mount device components with side of board, where components are soldered during soldering process

摘要

The method involves equipping a side of a printed circuit board (1) with through-hole technique (THT) components (3). Terminating ports (5) of the THT components are soldered on another side of the circuit board and arranged in a soldering wave part (7). Contacts (9) of surface mount device (SMD) components (21) are provided on the latter side of the circuit board by soldered terminal ends of the THT components. A stencil is printed with solder paste. The SMD components are fitted with the latter side of the board. The SMD components are soldered during a reflow soldering process.