POLYETHYLENE-BASED RESIN COMPOSITION FOR NON-CROSSLINKED FOAMING, AND FOAMING MOLDED ARTICLE CONTAINING THIS COMPOSITION, AND MOLDED PRODUCT FOR AGGREGATE PACKAGING OF ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide a foaming molded article including a polyethylene based resin composition for non-crosslinked foaming having such sufficient foaming states that the closed cell ratio is high and the uniformness of a cell and the appearance of a surface are sufficient, and excellent in flexibility, a mechanical characteristic, heat-resistance stability and secondary processability, in more detail, a gathering packaging molded product of an electronic part.;SOLUTION: The polyethylene based resin composition for non-crosslinked foaming is an ethylene single polymer or a copolymer of ethylene and a specific α-olefin, and is characterized in that it includes 90-40 mass% of a linear polyethylene (α) in which the density, melt flow rate, Mw/Mn, the number of melting point peaks of the endotherm curve and the crystallization temperature satisfy specific requirements, and 10-60 mass% of a branched low density polyethylene (β) by a high pressure method in which the density and melt flow rate satisfy specific requirements, and the melt tension at 190°C is 10-40 mN.;COPYRIGHT: (C)2011,JPO&INPIT