SOLDER BALL CHECK AND REPAIR DEVICE AND SOLDER BALL CHECK AND REPAIR METHOD

摘要

PROBLEM TO BE SOLVED: To provide a solder ball check and repair device that efficiently and surely repairs a defect at low cost when detecting the defect through a check after supplying a solder ball onto a substrate surface.;SOLUTION: In the solder ball check and repair device equipped with a dispenser for repair which checks the state of the solder ball mounted on an electrode pad of the substrate and supplies the solder ball to an electrode pad whose defect is detected, the dispenser 87 for repair has a suction nozzle 90 for holding the solder ball 24, a through-hole 92 formed in the suction nozzle 90, a mandrel 91 capable of freely moving in the through-hole 92 of the suction nozzle 90, and a driving mechanism for moving the suction nozzle 90 away from the solder ball 24 in a state wherein an end of the mandrel 91 presses the solder ball 24 to the electrode pad 120.;COPYRIGHT: (C)2010,JPO&INPIT